Directive on the Restriction of the uses of certain Hazardous substance in electrical and electronic equipment. The RoHS directive RoHS/2011/65/EU Champs Technologies Co, fully understands international environmental policies and principles and hereby declares that we will make every effort to comply with international environmental laws and regulations, monitor carefully our products and manufacturing processes, use no restricted or banned meterials or chemical substances, and provide lead-free and Eco-label material, components, products and packaging which meet the standards set up be laws, regulations and other organizations. |
為符合國際環保政策及對環境保護的原則,香榭沛頓科技股份有限公司U簡稱〝本公司〞)基於 此職責的重視下,本公司的各項產品及製造過程方面,均遵守國際環境保護法律的規範,努力達成國際環保要求之標準, 並有效管理本公司自我生產品質及製程,保證所提供之環保材料及零件,符合法規及其他社團要求. |
產品中禁止或限制的有害物質一覽表 List of Restricted Hazardous Substances in Products |
No |
物質 Substance |
極限濃度(PPM) Threshold Level |
1 |
鎘及其化合物 Cadmium and its compounds |
塗層、鍍層:不可檢出。 Coating, Plating: Not Detectable. |
焊料:20 Solders: 20 |
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其它:75 Other:75 |
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2 |
鉛及其化合物 Lead and its compounds |
100 塑膠(含橡膠等非金屬材料)、電纜、塗層、鍍層等中的鉛,包括聚氯乙烯。 Lead in plastics (including rubber and other nonmetal materials), cables, coating, plating etc. including PVC. 90 油墨、塗料 inks, Paints |
其它:800 Other:800 |
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3 | 汞及其化合物 Mercury and its compounds |
不可檢出 Not Detectable |
4 |
六價鉻及其化合物 Hexavalent chromium and its compounds |
金屬應用(包括電鍍):不可檢出。 For metallic application (including plating): Not Detectable. |
其它:100 (禁止刻意添加)。 Other:100 (Intentional Addition is prohibited). |
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5 |
鎳及其化合物 Nickel and its compounds |
與皮膚長期重復接觸的產品外部件中鎳釋放率小於0.5μg/cm2/WK。 For external parts likely to result in prolonged and repeated skin contact, the rate of nickel release is less than 0.5μg/cm2/WK. |
6 | 多溴聯苯 (PBBs) Polybrominated biphenyls |
不可檢出 Not Detectable |
7 | 多溴聯苯醚 (PBDEs) Polybrominated diphenylethers |
不可檢出 Not Detectable |
8 |
四溴雙酚 A (TBBPA) Tetrabromobisphenol A | 1000 |
除外 IC 封裝本體、印刷電路板、線材與連接器。 Except PCB,IC package,wire and connector. |
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9 | 六溴環十二烷 (HBCDD) Hexabromocyclododecane |
不可檢出 Not Detectable |
10 |
溴化阻燃劑 Brominated Flame Retardants |
產品外部塑膠件(在產品正常操作下可以被最終客戶看到的部份)及大於25g的塑膠件不可 檢出。 Not Detectable in external case plastic parts (parts visible to the end customer in normal product operation) and plastic parts weight more than 25 grams of products. |
11 | 多氯聯苯 (PCBs) Polychlorinated Biphenyls |
不可檢出 Not Detectable |
12 | 多氯三聯苯 (PCTs) Polychlorinated Terphenyls |
不可檢出 Not Detectable |
13 | 多氯化萘 (PCNs) Polychlorinated Naphthalenes |
不可檢出 Not Detectable |
14 |
短鏈和中鏈氯化石蠟C10-C17 Short and Medium Chained Chlorinated Paraffins C10-C17 |
短鏈氯化石蠟(C10-C13):不可檢出。 Short chain chlorinated paraffins (C10-C13): Not Detectable. |
中鏈氯化石蠟(C14-C17):1000。 Medium chain chlorinated paraffins (C14-C17):1000. |
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15 |
聚氯乙烯 (PVC) 以及聚氯乙烯混合物 Polyvinyl chloride and PVC blends |
產品外部零件(在產品正常操作下可以被最終客戶看到的部份)不可檢出。 Not Detectable in external parts (parts visible to the end customer in normal product operation) of products. |
不適用於電線電纜的護套及重量小於25克的塑膠。 Not apply to sheathing of wire and cable and plastics parts weight less than 25 grams. |
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16 | 氯化溶劑 Chlorinated Solvents |
制程中禁止使用。 Prohibited from use in manufacturing processes. |
17 |
三丁基錫(TBT)、三苯基錫(TPT)、三丁錫氧化物 (TBTO) Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO) |
不可檢出 Not Detectable |
18 | 石棉 Asbestos |
不可檢出 Not Detectable |
No |
物質 Substance |
極限濃度(PPM) Threshold Level |
19 | 特定偶氮化合物 Specific Azo compounds |
不可檢出 Not Detectable |
20 | 甲醛 Formaldehyde |
不可檢出 Not Detectable |
21 | 臭氧危害物質 Ozone depleting substances |
不使用於產品和制程中。 Not used in product and manufacturing process. |
22 |
氫氟碳化物 (HFCs)、全氫氟碳化物 (PFCs)、 六氟化硫(SF6) Hydrofluorocarbon, Perfluorocarbon, Sulfur hexafluoride |
不可檢出 Not Detectable |
23 | 放射性物質 Radioactive substances |
不可檢出 Not Detectable |
24 | 鹵化二苯基甲烷 Halogenated diphenyl methanes |
不可檢出 Not Detectable |
25 |
全氟辛烷硫磺酸 (PFOS) Perfluorooctane sulfonates |
物質或配制品:50;成品:1000;塗層:1μg/m2 Substance or preparation: 50; Article:1000; Coating: 1μg/m2 |
以上要求不適用以下的應用或製程中: | ||
- 影印工藝中防反射塗料。 | ||
- 工業攝影塗料。 | ||
- 電鍍鉻抑制劑。 | ||
- 抑制電鍍系統潤濕劑。 | ||
These requirements do not apply to the following applications or processes: | ||
- Photoresists or antireflective coatings for photolithography processes. | ||
- Photographic coatings applied to films, papers, or printing plates. | ||
- Mist suppressants for non-decorative hard chromium (VI) plating. | ||
- Wetting agents for use in controlled electroplating systems. | ||
26 |
鄰苯二甲酸酯 Phthalates |
1000 總含量 Sum of Concentrations |
27 |
多環芳香烴化合物 (PAHs) Polycyclic Aromatic Hydrocarbons | 在外部塑膠件和經常與皮膚接觸的軟表面中BaP不超過1ppm,總量不超過10ppm。 Prohibited from use in external plastics and soft surfaces that can experience frequent skin contact above 1ppm for BaP or 10 ppm for sum of Concentrations. |
28 | 二氯化鈷 Cobalt chloride |
不可檢出,用於乾燥劑(胿胶等)中的溫度指示劑。 Not Detectable, moisture indicator used for a desiccant agent (e.g. silica gel). |
29 | 特定苯并三氮唑 Specific benzotriazole |
不可檢出 Not Detectable |
30 | 五氯苯酚 (PCP) Pentachlorophenol |
不可檢出,各式用途,如木料防腐劑及殺蟲劑。 Not Detectable, all purposes (e.g. preservative and pesticide). |
31 | 發泡聚苯乙烯 (EPS) Expanded Polystyrene |
不可檢出 Not Detectable |
32 | 甲苯 Toluene |
1000 |
33 | 苯 Benzene |
1000 |
34 |
富馬酸二甲酯 (DMF) Dimethylfumarate | 0.1 各式用途,如防腐,防霉等。 All purposes (e.g. antiseptic). |
35 |
磷酸三(2,3- 二溴丙基)酯、三-(1-氮丙啶基)氧化膦 Tris(2,3dibromopropyl)phosphate, Tris-(aziridinyl)–Phosphineoxide |
禁止在與皮膚接觸的紡織品材料(如:皮帶和耳機)中使用。 Prohibited from use in textile articles intended to come into contact with skin (e.g. wrist straps and headphones.). |
36 |
二-μ-氧-正丁基锡羟基硼烷/二丁基锡氢硼烷 (DBB)(CAS 75113-37-0) Di-μ-oxo-di-n-butylstanniohydroxyboRane (CAS No75113-37-0) |
1000 |
37 |
砷及其砷化合物 (As) Arsenic and its compounds |
木制品(棧板)、塗料、油墨:不可檢出;其它:1000 (半導體芯片(僅指管芯),PCB / FPC |
中的銅箔豁免)。 | ||
wood products (Pallets), paints, inks: Not Detectable; Others:1000 (Not apply to semiconductor chips (die only) and copper alloy foil in PCB / FPC). | ||
10 螢幕玻璃 Display glass |
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38 |
鈹及其化合物 Beryllium and its compounds |
不可檢出 |
所有用途(陶瓷電子元件和電氣連接應用的鈹銅,如連接器、彈簧或EMI 墊片除外)。 Not Detectable All applications(Excluding ceramics in electronic components and electrical bonding |
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applications of beryllium-copper, such as connectors, springs, or EMI gaskets). |
No |
物質 Substance |
極限濃度(PPM) Threshold Level |
39 | 二丁基錫(DBT)化合物 Dibutyltin (DBT) compounds |
1000 |
40 | 二辛基錫 ( DOT ) 化合物 Dioctyltin (DOT) compounds |
1000 |
41 |
磷酸三(2-氯乙基)酯(TCEP) Tris(2-chloroethyl) phosphate (TCEP) |
1000 塑膠、樹脂、籤维、布料的阻燃劑用途。 Flame retardants used in plastics, resins, fabrics, and textiles. |
42 |
雙酚A (CAS 80-05-7) Bisphenol-A (CAS No 80-05-7) |
50 各式用途,如環氧樹脂(epoxy resin),聚碳酸脂樹脂(PC)及其他塑膠中。 All purposes (excluding epoxy resin, polycarbonate and other plastics). |
43 | 高氯酸鹽( CAS No. 7791-03-9) Perchlorates ( CAS No. 7791-03-9) |
0.006ppm (鈕扣電池除外) 。 Prohibited from use in all products above 0.006ppm. (except the coin cell batteries ). |
44 | 銻及其化合物 Antimony and its Compounds |
1000 |
45 | 紅磷 Red Phosphorus |
1000 |
46 |
無鹵素 (溴、氯) Halogen-Free (Br、Cl) |
溴及其化合物 900;氯及其化合物 900;溴及其化合物 + 氯及其化合物 1500 Br and its compounds 900; Cl and its compounds 900; Br + Cl and its compounds 1500 非無鹵產品不適用。 This item of substance, Non Halogen-Free Product is not applicable. |
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